conga-BS57: COM Express module based on Intel® Core™ i7 technology
Latest Intel® low-power processors in a small form factor (SFF) BGA package
Soldered CPUs for higher shock resistance
High 3-D graphics performance
Ideal solution for low power and high graphics applications
Up to 3x HDMI/DisplayPort
conga-BS57 |
COM Express - Type 2 Pinout - Basic Form Factor (95x125mm²) |
CPU |
Intel® Core™ i7-620LE, 2.0 GHz (32 nm process, 4MB cache, 1066 MHz, TDP 25 W, BGA package) Intel® Core™ i7-620UE, 1.06 GHz (32 nm process, 4MB cache, 800 MHz, TDP 18 W, BGA package) Intel Core™ i3-330E, 2.13 GHz (32 nm process, 3MB cache, 1066 MHz, TDP 35 W, BGA package) Intel® Celeron® U3405, 1.07 (32 nm process, 2MB cache, 1066 MHz, TDP 18 W, BGA package) |
DRAM |
2 Sockets, SO-DIMM DDR3 1333 MHz, up to 8 GByte |
I/O Interfaces |
5x PCI Express™ lanes, 3x Serial ATA® (AHCI) no RAID support, 1x EIDE (UDMA-66/100) optional, 2x ExpressCard®, 8x USB 2.0 (EHCI), PCI bus 33 MHz Rev. 2.3, LPC bus, I²C bus (fast mode, 400 kHz, multi-master) |
Graphics |
Processor integrated Mobile Intel® 5 Series HD graphics, OpenGL 2.1 and DirectX10 support, Two independent pipelines for full dual view support, High performance hardware MPEG-2 decoding, WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 MBit/s, hardware motion compensation, no PEG support |
DisplayPort (DP) |
3x DisplayPorts 1.1 shared with HDMI |
HDMI |
3x ports shared with DisplayPorts |
congatec Board Controller |
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control |
Power Management |
ACPI 3.0 with battery support |
Datasheets
Datasheet conga-BS57July 21, 2010 |
 conga-BS57_01.pdf |
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